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Cure Behavior by Dynamic Mechanical Analysis ASTM D4473

ASTM D4473


Cure Behavior by Dynamic Mechanical Analysis determines the cure properties of thermosetting resins by isothermal heating or thermal ramping in an oscillatory mode. Properties such as elastic modulus (or storage modulus, G'), viscous modulus (or loss modulus, G''), complex modulus (G*), complex viscosity (n*) and damping coefficient (Tan D) as a function of temperature or time can be determined.

Test Procedure:
The test sample is dispensed between the movable and stationary parallel plate fixtures, and then enclosed in the thermal chamber. Frequency, amplitude, and a temperature range appropriate for the material are input in the equipment. The analyzer applies torsional oscillation to the test sample while slowly moving through the specified program.

Specimen size:
Typically several grams of thermosetting material is required. Typical specimen sizes include 8mm, 25mm or 50mm depending on the viscosity of the material.

Results are typically provided as a graphical plot of G', G'', G*, n* and Tan D versus temperature or time.

Key Properties:
The intersection of the G and G curves is defined as the Gel Point of the thermosetting resin system.

Sample Graph Result:
A typical DMA test result graph

Equipment Used:
Rheometric Scientific RDA III Dynamic Mechanical Analyzer

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**Please note that this test description is intentionally generic in nature and aimed at providing a descriptive summary to enhance test understanding. For more information please contact a Intertek PTL Technical Representative at . Due to copyright restrictions, we are not able to provide copies of standards. Standards can be obtained from appropriate standards authorities.

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